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Thermal Joint Compound, 4g, Single Use

Thermal Joint Compound, 4g, Single Use

Thermal Joint Compound, 4g, Single Use

Thermal Joint Compound, 4g, Single Use
Catalog # DICO-0086
Model #: 860-4G
Thermal Joint Compound, 4g, Single Use * High thermal conductivity * High dielectric constant * High dissipation factor * Use with heat sinks or metal chassis * Will not dry or harden ` * Meets MIL-DTL-47113D Designed for use in transferring heat away from electrical and electronic devices such as transistors, power diodes, semiconductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
 

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$2.70
 

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Thermal Joint Compound, 4g, Single Use