Thermal Joint Compound, 4g, Single Use
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Catalog #
DICO-0086 |
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Thermal Joint Compound, 4g, Single Use
* High thermal conductivity
* High dielectric constant
* High dissipation factor
* Use with heat sinks or metal chassis
* Will not dry or harden `
* Meets MIL-DTL-47113D
Designed for use in transferring heat away from electrical and electronic devices such as transistors, power diodes, semiconductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. |
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